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| Company name |
NEC TOPPAN CIRCUIT SOLUTIONS, INC. |
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| Business area |
Manufacturing, sales and R&D of PWB and IC substrates |
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| Established |
October 1, 2002 |
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| Headquarters |
2-7 Yaesu 2-chome, Chuo-ku, Tokyo |
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| President |
Keiji Miyajima |
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| Capital |
1 billion yen |
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| Fiscal year end |
March 31 |
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| Shareholders |
Toppan Printing Co., Ltd. (55%) and NEC Corporation (45%) |
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| Subsidiary |
NEC TOPPAN CIRCUIT SOLUTIONS PHILIPPINES,INC.
NEC TOPPAN CIRCUIT SOLUTIONS USA,INC. |
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Toppan Printing Co., Ltd. |
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NEC Corporation |
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| 1963 |
Established mass production line at Sagamihara Plant |
| 1966 |
Established multilayer PWB manufacturing line |
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| 1970 |
Started PWB production with technical assistance from Bureau of Engraving from the United States Started mass production of PWBs at Asaka plant |
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| 1975 |
Production of PWBs with buried vias |
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| 1972 |
Manufacture high density copper through-hole PWBs |
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Established NEC Toyama Plant |
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| 1978 |
Volume production of PWBs with three-track technology |
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| 1984 |
Established Niigata Plant |
| 1985 |
Production of PWBs with surface vias |
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| 1985 |
Volume production of PWBs with photo solder resist and landless through-holes |
| 1987 |
Volume production of heat-resistant pre-flux (NPS-87) for SMT |
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| 1991 |
Deming Award presented to Niigata Plant |
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| 1993 |
Niigata Plant acquired ISO 9002 |
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"T-SSS" (Selective Solder Strip Technology) production method |
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| 1996 |
Manufacture of "T-RCP" Build-up |
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| 1998 |
TPM Excellence Award presented to Niigata Plant |
| 1999 |
Production of environment-friendly, halogen-free PWBs |
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| 1991 |
Volume production of PWBs with five-track technology |
| 1992 |
Volume production of P&SVH |
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Full-scale manufacture of environmental-friendly surface (NEPS-90).
TPM Excellence Award presented to NEC Toyama |
| 1993 |
NEC Toyama Plant acquired ISO 9002 |
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| 1994 |
TPM Continuous Excellence Award presented to NEC Toyama |
| 1995 |
Manufacture of "DV MULTI" Build-up PWBs |
| 1996 |
Established NEC Components Philippines |
| 1997 |
NEC Toyama Plant acquired ISO |
| 1998 |
Introduction of "Kattobi-TAT"quick turn prototype service |
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| 2000 |
Niigata Plant acquired ISO 14001 |
| 2001 |
Manufactured "T-PPP" PWBs with copper filled |
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TPM Continuous Excellence Award presented to Niigata Plant |
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| 2001 |
Development and volume production of 25μm line/space build-up process |
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| 2002 |
NEC TOPPAN CIRCUIT SOLUTIONS (TNCSi) launched as PWB divisions of Toppan Printing Co., Ltd. and NEC Corporation merge |
| 2003 |
Acquired ISO9001certification (2000 version) |
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Started mass production of filled via |
| 2004 |
Started mass production of FCBGA PWBs |
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Niigata plant received "TPM Special Award" |
| 2005 |
Started mass production of thin build-up PWBs |
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Started mass production of rigid-flex PWBs |
| 2006 |
Started mass production of component-loaded PWBs |
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Toyama plant received Ministry of Economy, Trade and Industry (electrical division) prize for excellent energy management |
| 2007 |
Niigata plant received "TPM Advanced Special Award" |
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