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Build-up PWBs

Build-up PWBs Microvia TM series

Build-up print PWBs with ultra-fine wiring support the demand for high-density component mounting for both consumer (mobile phones and DSCs) and system (mobile phones as wireless base stations) applications.
Features
Achieves fine circuit patterns of 75μm or less
Enhanced wiring freedom through via-on-IVH and via-on-via
Fine via-holes of 100μm or less
Ultra-high density mounting through stacked via
Embedding of coated via components enhances connecton reliability
Thickness stability between layers enhances impedance accuracy
High peel strength facilitates component repair
Specification summary
Item
Maximum build-up layers 3 per side
Line/space　（Ｍｉｎ） 75/75μm　（50/50μm）
Via diameter(hole/land) 75/200μm
Minimum pad width/interval 50/50μm
Product applications
Mobile phones
Digital video cameras
Mobile phones as wireless stations
High-end servers
Products requiring high-density mounting and high reliability