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Ultra-fine wiring meets the need for high-density surface mounting in electronic devices like mobile phones and digital video cameras. |
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The latest high-density, multilayer print PWBs achieve high-precision, ultra-fine wiring and high aspect ratios. |
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High-density, high-functioning semiconductor packaging substrates combine build-up and semi-additive technologies. |
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Achieves 3-D layout to support the combined demands for free-design wiring and reliability. |
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Component-embedded PWBs component loading space and electrical performance. Board sizes can be reduced by one-half to one-third. |
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