Development, design, production, and sale of Printed Circuit Boards NEC TOPPAN CIRCUIT SOLUTIONS,INC
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製品とサポート
Build-up PWBs
High Density Multilayer PWBs
Rigid-flex PWBs
Component-embedded PWBs
Design/Simulation
Transmission line analysis
Emission analysis
Power plane resonance analysis
DC power distribution analysis
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Ultra-fine wiring meets the need for high-density surface mounting in electronic devices like mobile phones and digital video cameras.
The latest high-density, multilayer print PWBs achieve high-precision, ultra-fine wiring and high aspect ratios.
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Achieves 3-D layout to support the combined demands for free-design wiring and reliability.
Component-embedded PWBs component loading space and electrical performance. Board sizes can be reduced by one-half to one-third.
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Supports designs that maximize chip capacities by drawing on expertise in advanced product design.
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Analysis to reduce development requirements and costs at the design stage for systems conducive to operating verification.
We make proposals to optimally reduce causes of EMI at the design stage.
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We offer optimal power plane designs and PC layouts to reduce the causes of EMI (electro-magnetic interference) and jitter.
We analyze DC power distribution and optimal power design to prevent IR drop.
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