| Alongside enhanced performance of electronic devices, a range of high functionality is also demanded of semiconductor packages, including higher LSI multi-pin count and higher GHz speeds. At NEC Toppan, we have responded quickly to these needs by offering high-density and high-functionality semiconductor package substrates combining semi-additive technologies with build-up technologies perfected by mass production of microvia™. |
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| Flip chip (FC) with multi-pin, high-density functions required in ASICs, CPUs, and GPUs.Supports lead- and halogen-free mounted packaging substrates. |
SiP substrate
Multi-chip packages for smaller and thinner devices such as cellular phones and digital cameras |
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| Microprocessors(CPU) |
| Graphic processors(GPU) |
| Peripheral chip set |
| Game-type CPUs and GPUs |
| Applications processors |
| Digital Signal processors(DSP) |
| Baseband processors |
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2005 |
2006 |
2007 |
2008 |
| Market |
Servers
Communications |
Games
Peripheral devices |
Digital AV
Automobiles |
Mobile
Devices |
| Diffusion node(nm) |
65 |
65 |
55 |
45 |
| PKG structure |
FCBGA
(Fine-pitch core) |
FC-SiP(MCM) |
Thin core |
Ultra-thin coreMLTS |
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| PKG external |
27-55mm |
19-55mm |
15-55mm |
10-55mm |
| Build-up layer |
Line
/space |
20/20um |
18/18um |
15/15um |
12/12um |
Via
/land diameter |
50/80um |
50/80um |
50/80um |
45/70um |
| Pad pitch |
180um |
170um |
150um |
130um |
| Core layer |
Line
/space |
50/50um |
40/40um |
30/30um |
30/30um |
Via
/land diameter |
100/250um |
100/220um |
100/190um |
75/165um |
| Through-hole pitch |
300um |
250um |
225um |
200um |
| Core thickness |
0.4mm |
0.4mm |
0.2mm |
0.1mm |
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