| We provide advanced high-density, multilayered PWBs achieving high-precision, ultra-fine wiring and high aspect ratios based on our technologies. |
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| Features |
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Supports 0.06mm core |
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Maximum layer count: 50
Board thickness: Up to 6.5mm |
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Supports impedance control |
| Applications |
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Large-scale computing |
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Computer peripherals |
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Communications devices |
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Measuring devices |
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Multi-layered substrate
(high aspect ratio) |
| Layer count |
46 |
| Board thickness |
3.9mm |
| Thickness between layers |
0.06mm |
| Drill diameter |
ø0.20 |
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| Features |
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Maximum layer count: 28 |
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Supports impedance control |
| Applications |
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Communications devices |
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Measuring devices |
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| Multilayer, multiple laminated PWB (pasted) |
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| Features |
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Supports impedance control |
| Applications |
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Communications devices |
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Measuring devices |
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| PWB with high multilayer condensor function |
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| Features |
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Supports field via |
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Supports two-stage build-up |
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Supports impedance control |
| Applications |
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Measuring devices |
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Base stations |
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High multilayered
build-up PWB |
| Layer count |
46 |
| Structure |
1-24-1 |
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| Item |
Specification |
| Layer count |
4 to 50 layers |
| Board thickness |
0.4 to 6.5mm |
| Material |
FR-4, FR-5 equivalent,
various low dielectric materials, BT,
polyimide |
| Maximum board size |
477×699mm |
| Maximum aspect ratio |
20 |
| Via Type |
BVH、IVH |
*More advanced technologies are available upon request. |
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