Development, design, production, and sale of Printed Circuit Boards (PWBs and packaging substates) NEC TOPPAN CIRCUIT SOLUTIONS,INC
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Products and support
Build-up PWBs
High Density Multilayer PWBs
High Density Semiconductor Packaging Substrates
Rigid-flex PWBs
Component-embedded PWBs
Design/Simulation
Transmission line analysis
Emission analysis
Power plane resonance analysis
DC power distribution analysis
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Products and support
> Rigid-flex PWBs
Our company's rigid-flex PWBs meet our customers' wide-ranging requirements.
Connector-free, miniaturized, thinner 3-D layout
Same mounting and handling as rigid PWBs
Same expandability and high-reliability as rigid PWBs.
Pad-on-via using filled via for build-up components
Free-design, large-layer structure includes flying-tail layout
Layer structure of 6-layer build-up rigid-flex PWB with flying tail
Maximum build-up layers
2 per side
Line/space
100/100μm
IVH
OK
Maximum board size
470×470mm
A wide range of products requiring high reliability including hand-held terminals, medical devices, and communications devices.
inquiry about Rigid-flex PWBs
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