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Component-embedded PWBs

Proposals for further miniaturization and weight reduction

Demand is rising for combined miniaturization, weight reduction, enhanced functions, and higher speeds in mobile devices. In response, we propose the use of Component-embedded PWBs to enhance component loading space and electrical performance (enabling shorter signal wiring length).
Features
Effective use of both sides of PWB
(1) Passive embedded element
Board thickness: 0.55mm to 0.75mm
繝サVIA/Land =ø75um/ø175um
繝サIVH drill/Land =ø200um/ø350um
繝サL/S=75um/75um
 
Internal resistor and condensor elements
Embedded component numbers can be adjusted according to client's supply needs
Enhanced electrical performance
(2) Active embedded element
Board thickness: 0.73m
繝サVia/Land =ø75um/ø175um
繝サIVH drill/land =ø200um/ø350um
繝サL/S=75um/75um
Effect of elements' internalized modules
Internal WLP element
WLP size: 6.50mm
WLP thickness: 0.30mm
Post diameter: 0.25mm
Post pitch: 0.50mm
Connecting with WLP