HOME >  Topics >  TNCSi will release the new Micro via PWBs:
BGA Interposer Boards and Super Thin Micro Via Boards

TNCSi will release the new Micro via PWBs:
BGA Interposer Boards and Super Thin Micro Via Boards

Jan 21, 2003
NEC TOPPAN CIRCUIT SOLUTIONS, INC.


NEC TOPPAN CIRCUIT SOLUTIONS, INC. (hereunder: TNCSi, Head Office; Chuo-ku, Tokyo,
Japan. President Yukio Tagawa) will start a new business of BGA Interposer Boards:
micro via boards for semiconductor package, to expand our feature PWB business domain.
NEC TOPPAN CIRCUIT SOLUTIONS TOYAMA, INC.; 100% subsidiary of TNCSi is supposed to be in charge of mass production for the new items.

Moreover, TNCSi is also planning to release simultaneously the Super thin micro via boards,
in addition to our product line, which are desirable PWBs for super thin and high-density
semiconductor package attach. The new products are commercialized on basis of the technology, of which NEC and NEC Electronics, inc. developed basic process.

TNCSi will have prepared for supply the BGA Interposer Boards in volume of 1,500,000 units per
month in the 1st quarter, 2003 fiscal year, and to reinforce the quantity of the production
for 12,500,000 monthly output in 2005 fiscal year. The estimation of total investment is up to
10 billion yen until 2005.


• Nowadays, the technical innovations for semiconductor package is so fast and remarkable
in due to miniaturize applications and improve them for high function and high frequency.
Such high advanced semiconductors have been released into market, for example, "FC-BGA"
(Flip-Chip BGA): Flip Chip attaches with the large number of pin layout package, "CSP"(Chip Sized Package) micro semiconductor package, "MCP" (Multi Chip Package): possible to place multi chip in one package. It is increasing market demand for Super high density PWBs using fully micro via
technology when application manufactures assembly PWBs with those new packages.
• Also, the demand for Super thin type PWBs is increasing in corresponding to the semiconductor package which is thinner or more lightweight, especially for Cellular phone,
Digital still camera, etc. However, the substrates PWBs for the semiconductor packages have not been provided to those markets at present stage.


• TNCSi has been already experienced of much micro
via mother boards business for consumer applications and infrastructure systems such as Digital Still Camera, W-CDMA base station
and so on. The company will also provide the high-density BGA interposer boards on making full
use of our developed technology and experiences.
• TNCSi is sure to respond to the market demands for new technology with the Super thin
semiconductor package boards.
• Prepared the supply system and organization cohered from interposer to mother boards,
TNCSi will provide best solutions of micro via technology to support our customers development
at sample stage through mass production with our delivery and service.
Our company could particularly offer pattern design solutions, which made use of the electrical
simulation and heat characteristic simulation technology based on our survey and experiences.


• Our Super thin micro via boards, which is equivalent to a tape thickness and with high-density,
have been realized with the etching process which remove the base metal board after lamination
of Build-up layer on it one by one.
• This new process enables PWBs to reduce the number of layers and board thickness, since the Super thin micro via boards have no core layers that is unique technical point compared with
conventional PWBs. In case of 4 layer micro via boards (Board thickness 0.4mm), TNCSi could
offer to minimize it to 2 layers (Board thickness 0.06mm).


• TNCSi is planning to start the mass production of the Super thin micro via boards for CSP and
MCP attaches in 2003, and apply to the large number of pin layout BGA attaches, etc. in 2004.