Development, design, production, and sale of Printed Circuit Boards (PWBs and packaging substates) NEC TOPPAN CIRCUIT SOLUTIONS,INC.,

NEC TOPPAN CIRCUIT SOLUTIONS, INC
MEADVILLE TECHNOLOGIES GROUP, LTD

NEC TOPPAN CIRCUIT SOLUTIONS, Inc. (Head office; Chuo-ku, Tokyo, Japan, President;
Yukio Tagawa) (hereinafter called "TNCSi") and Meadville Technologies Group Ltd. (Head Office: Hong Kong, China, Managing Director; Tom C. Tang) (hereinafter called "Meadville") have
concluded the technology transfer and license agreement of manufacturing technology of build-up printed circuit board, and also have agreed to establish a framework of cooperation focusing
on mutually complementary supply of printed circuit board, including conventional multi-layer
boards, through an active use of the sales network of Meadville and TNCSi.

TNCSi has three (3) manufacturing factories, two (2) in Japan and one (1) in Philippines, the core
product of which is build-up printed circuit board mainly used for cellular phones and digital
still cameras. Nowadays, the demand of such board, as well as conventional type board, is
expanding greatly in China.

In order to correspond to this expanding demand, TNCSi has been improvingits manufacturing
lines for strengthening of the product supply from the Philippine factory. However, the speed of
expansion of such demand is faster than expected, so TNCSi's manufacturing capacity seems
not to be enough according to current schedule.

Therefore, in order to correspond to the market demand in China quickly and also to maximize
the effect of capital investment toward new products and new technologies in Japan, TNCSi has
been looking for a business partner in China.

In the meantime, Meadville has been actively investing in business of printed circuit boards,
including build-up boards, in order to correspond to the market demand for leading-edge products in China. So, Meadville has been looking for cutting-edge technologies to strengthen its ability to
supply new products and also to secure its firm position in the market.

Thereafter, Meadville and TNCSi have come to share win-win strategy and conclude the
agreement this time.

TNCSi and Meadville have agreed as follows:

• 1.Meadville agrees to receive the technologies with respect to high-density build-up printed circuit
  board from TNCSi.
• 2.Manufacturing at Meadville will be done at SME- Shanghai Meadville Electronics (location:
  Shanghai, China), and SYE- Dongguan Shengyi Electronics (location: Dongguan, China) among
  Meadville Group for the demand for high-density build-up printed circuit board mainly for mobile
  appliances.
• 3.TNCSi will purchase, by OEM scheme, build-up printed circuit board manufactured as a result of such technology transfer mainly for China domestic market, and Meadville and TNCSi will work
  together for market cultivation there.
• 4.Both parties will continue to discuss on further expansion of the scope of mutual cooperation in near future.

TNCSi will satisfy the customers' demand for local procurement by supplying the finished
products, to be manufactured by Meadville through the technology transfer of widely-experienced
build-up boards (product name: "DV-multi"*) to Meadville. On the other hand, TNCSi will
promote development and manufacturing of higher density printed circuit boards domestically.

*"DV-multi" is high-density build-up printed circuit board to be manufactured and sold by TNCSi.
Since its development in 1995, DV-multi has leading experience of actual shipment in Japan mainly for applications of mobile phones, digital still cameras, digital video cameras, etc.

NEC TOPPAN CIRCUIT SOLUTIONS, Inc.
Manager : Naoto Shinada
TEL : +81-3-3276-8371 (Office)
E-MAIL : info@tncsi.com

ORIENTAL PRINTED CIRCUITS LIMITED
(A Member of the Meadville Technologies Group)
DDeputy Managing Director : Paul Pang
TEL : +852-2660-3100 (Office)
E-MAIL : plpg@opc.com.hk